Thermal Cap - CP Series | T-Global Thermal Technology
About | Environment | Research | Products | News&Events | FAQs

Home > Products > CP Series Thermal Cap

 

DATASHEET MSDS ROHS Sample

CP Series Thermal Cap

Features

  • Low Thermal Contact Resistance
  • Electrically isolating
  • Complies with UL Standards

Applications

  • Electronic components: IC、CPU、MOS…
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub…
  • DDR II Module、DVD Applications、Hand-set applications…

Thermal Impedance V.S Pressure (mouse over) (mouse over)

Property CP22/ CP23/ CP33 Unit Tolerance Test Method
Thermal Conductivity
1.9
W / mK
±0.19
ASTM D5470
Thickness
0.3/0.45
mm
-
ASTM D374
Color
Gray
-
-
Visual
Material
Silicone
-
-
-
Op. Temp. range
-45 to 180
°C
-
-
Density
2.55
g / cm3
-
ASTM D792
Breakdown Voltage AC
4 / 6
KV
±0.4/±0.6
ASTM D149
Breakdown Voltage DC
6 / 8
KV
±0.6/±0.8
ASTM D149
Dielectric Constant
5.8
1000Hz
-
ASTM D150
Thermal Impedance
-
-
-
-
t=0.3mm 10psi
1.16
°C - in2 / W
-
ASTM D5470
  20psi
1.1
°C - in2 / W
-
ASTM D5470
50psi
1
°C - in2 / W
-
ASTM D5470
TML
<0.2
%
-
ASTM E595
Hardness
75
Shore A
±7
ASTM E595

REACH Compliant RoHS Compliant

CP22 CP23 CP33