Thermal Conductive Pad H48-2K | T-Global Thermal Technology
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Home > Products > Thermally Conductive Silicone Interface Pads > H48 Series Thermal Conductive Pad > H48-2K Thermal Conductive Pad

Thermal Compound Manufacturer

Available to apply adhesive,
pre-cut for different shape.

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H48-2K Thermal Conductive Pad

Feature

  • Very good thermal conductivity
  • Non-reinforement carrier
  • Low contact thermal impedance
  • Non-Oil Bleed
  • High dielectric breakdown Voltage

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Thermal Paste Manufacturer Ceramic Heat Spreader
Property H48-2K Unit Tolerance Test Method
Thermal Conductivity
2.2
W / mK
±0.2
ASTM 5470
Thickness
0.1/0.2/0.3
mm
-
ASTM D374
Color
Dark Red
-
-
Visual
Flame Rating
V-0
-
-
UL 94
Dielectric Breakdown Voltage
1.2/2.5/3.5
KV
±0.1/±0.2/±0.3
ASTM D149
Weight Loss
<0.5
%
-
ASTM E595
Specific Gravity
2.4
g / cm3
±0.2
ASTM D792
Working Temperature
-45~+200
°C
-
-
Volume Resistance
>1011
Ohm - m
-
ASTM D257
Elongation
50
%
-
ASTM D412
Standard Shape
Sheet ones
-
-
-
Hardness
85
Shore A
±5
ASTM D2240

Thermal Interface MaterialREACH Compliant Non-silicone Thermal Pad Thermal Compound Thermal Interface MaterialRoHS Compliant Non-silicone Thermal Pad Thermal Compound Thermal Interface MaterialUL Compliant

     

Need samples?

Available to apply adhesive

Pre-cut for different shapes