Thermal Conductive Pad H48-6 | T-Global Thermal Technology
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Home > Products > Thermally Conductive Silicone Interface Pads > H48 Series Thermal Conductive Pad > H48-6 Thermal Conductive Pad

Non-silicone Thermal Pad Thermal Compound Manufacturer

Available to apply adhesive,
pre-cut for different shape.

DATASHEET MSDS RELIABILITY ROHS UL

H48-6 Thermal Conductive Pad

Feature

  • Very good thermal conductivity
  • soft and high compressibility
  • Natural tack
  • Easy to assemble
  • Very good insulator

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Ceramic Heat Spreader Non-silicone Thermal Pad
Property H48-6 Unit Tolerance Test Method
Thermal Conductivity
3.2
W / mK
±0.3
ASTM D5470
Color
Dark Gray
-
-
Visual
Thickness(the thickness can be ordered)
0.3~20
mm
-
ASTM D374
0.0118~0.787
inch
-
ASTM D374
Flame Rating
V-0
-
-
UL 94
Dielectric Breakdown Voltage
2
KV / mm
±0.2
ASTM D149
Weight Loss
<1
%
-
ASTM E595
Specific Gravity
2.42
g / cm3
±0.2
ASTM D792
Working Temperature
-40~+200
°C
-
-
Volume Resistance
>1011
Ohm-cm
-
ASTM D257
Elongation
130
%
-
ASTM D412
Tensile Strength
8
Kgf / cm2
-
ASTM D412
Standard Shape
Sheet ones
-
-
-
Hardness
30
Shore A
±10
ASTM D2240

Thermal Adhesive TapeREACH Compliant LED Thermal PadRoHS Compliant LED Thermal PadUL Compliant

     

Need samples?

Available to apply adhesive

Pre-cut for different shapes