Thermal Conductive Adhesive Tape Li-98 | T-Global Thermal Technology
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Gap Filler

pre-cut for different shape.

DATASHEET MSDS ROHSSample

Li-98 Thermal Conductive Adhesive Tape

Feature

  • Good adhesion (Acrylic PSA)
  • Good thermal conductivity
  • Soft and compressibility
  • Easy to assemble

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

 

(mouse over)

Thermal Pad Thermal Interface Material
Property Li-98 Li-98C Li-98CN Unit Tolerance Test Method
Thermal Conductivity
0.95
0.95
1.8
1.8
2
W / mK
±10%
ASTM D5470
Thickness / Color
0.15
0.25
0.15
0.25
0.18
mm
-
ASTM D374
White
-
-
Visual
Reinforcement Carrier
Fiberglass mesh
-
-
-
-
Continuous Working Temperature
-30 to 120
-30 to 120
-30 to 120
-30 to 120
-30 to 120
°C
-
-
Short time use temperature (30sec)
200
200
200
200
200
°C
-
-
Density
1.85
1.85
1.8
1.8
1.8
g / cm3
-
ASTM D792
Tensile strength
200
400
200
400
-
psi
-
ASTM D412
Glass Transition temperature
-30
-30
-27
-27
-30
°C
-
-
Initial Tack
10
8
14
12
15
cm
-
PSTC-6
Lap Shear Strength
61
61
55
50
55
N / cm2
-
ASTM D1002
Die Shear Strength@25°C
120
120
109
100
100
N / cm2
-
-
Die Shear Strength@80°C
69
69
68
68
55
N / cm2
-
-
Holding Power 1000g@25°C using 1 in2
>10000
>10000
>10000
>10000
>10000
min
-
PSTC-7
Holding Power 1000g@80°C using 1 in2
>10000
>10000
>10000
>10000
>10000
min
-
PSTC-7
90° Peeling Strength (aluminum)
>10
>12
>6
>8
>8
N / in
-
ASTM D3330
Dielectric Breakdown Voltage (Vac)
2
3
2
3
5
KV
±10%
ASTM D149
Dielectric Breakdown Voltage (Vdc)
3
4
3
4
6
KV
±10%
ASTM D149
Thermal Impedance@10psi
0.96
1.3
0.66
0.92
0.75
°C-in2 / W
-
ASTM D5470
Thermal Impedance@30psi
0.78
1.08
0.62
0.88
0.7
°C-in2 / W
-
ASTM D5470
Thermal Impedance@50psi
0.63
1.095
0.55
0.9
0.68
°C-in2 / W
-
ASTM D5470

REACH Compliant RoHS Compliant

     

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