Non-Silicone Thermal Conductive Pad PC93 | T-Global Thermal Technology
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Home > Products > Non-Silicone Thermal Conductive Pad > PC93 Non-Silicone Thermal Conductive Pad

Ceramic Heat Spreader

pre-cut for different shape.

MSDS ROHS UL

PC93 Non-Silicone Thermal Conductive Pad

Feature

  • Low contact thermal impedance
  • Good thermal conductivity
  • Silicone free
  • Long term stability

Application

  • Electronic components: IC、CPU、MOS.
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Ceramic Heat Spreader Thermal Adhesive Tape LED Thermal Pad MCPCB Gap Filler Thermal Paste
Property PC93 Unit Tolerance Test Method
Thermal Conductivity
2
W / mK
±0.2
ASTM D5470
Thickness (the thickness can be ordered)
0.5~5.0
mm
-
ASTM D374
0.0197~0.1969
inch
-
ASTM D374
Color
Gray灰
-
-
Visual
Flame Rating
V-0
-
-
UL 94
Dielectric Breakdown Voltage
10
KV / mm
±1
ASTM D149
Weight Loss
<1
%
-
ASTM E595
Specific Gravity
2.1
g / cm3
±0.2
ASTM D792
Working Temperature
-30~+125
°C
-
-
Volume Resistance
>1012
Ohm-cm
-
ASTM D257
Elongation
350
%
-
ASTM D412
Tensile Strength
1
Kgf / cm2
-
ASTM D412
Standard Shape
Sheet ones
-
-
-
Hardness
65
Shore 00
±10
ASTM D2240

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Need samples?

Pre-cut for different shapes