Heat Spreader PH3 | T-Global Thermal Technology
About | CSR | Research | Products | News&Events | FAQs

Home > Products > PH3 Heat Spreader

MSDS ROHS

PH3 Heat Spreader

Feature

  • Component junction temperature reduction of 20℃is typical. Easily added to existing designs to lowest component temperatures, improve reliability.

  • Pre-cut for different shape.

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

 

(mouse over)

Thermal Adhesive Tape
Physical Properties PH3 Unit Tolerance Test Method

Thickness

0.06 0.11 0.21

mm

±10%

ASTM D374

Color

Black

-

-

Visual

Reinforcement Carrier

Cu Foil

-

-

-

Filler

High Thermal Radiation Nano-carbon Tube

-

-

-

Heat Emissivity Coefficient

0.96 0.96 0.96 1

-

-

Metal Layer Thermal Conductivity

400 400 400

W / mK

-

ASTM D5470

Coating Layer Thermal Conductivity

1.2 1.2 1.2

W / mK

-

ASTM D5470

Surface Resistance

1012 1012

1012

Ωcm

-

-

Continuous Working Temperature

-30 ~ 120

-30 ~ 120

-30 ~ 120

°C

-

-

Initial Tack

18

15

11

cm

-

PSTC-6

30o Peeling Strength (aluminum)

8

10

12

N / in

-

ASTM D3330

Breakdown Voltage(AC)

>2

>2

>3

KV

-

ASTM D149

Breakdown Voltage(DC)

>3

>3

>4

KV

-

ASTM D149

     

Need samples?

 

 


LED Thermal Pad