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Silicone-Free Thermal Conductive Putty

 

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TG-NSP25 Non-Silicone Thermal Putty

Feature

  • TG-NSP25 is an ultra conformable silicone-free putty type gap filler. It is designed for when heat transfer is needed between delicate components where the pressure must be minimised and silicone contamination cannot be tolerated. TG-NSP25 is designed to fill gaps from 0.25 – 8mm with little or no stress generated. The non-silicone formulation will adhere to all surfaces, such as metal housings, ceramic and plastic IC packages and FR4 boards to give a low thermal resistance path for heat transfer.
  • TG-NSP25 is a silicone-free type spacer with 2.5W/mk
  • Have enough compressibility
  • Very low thermal resistance
  • Best for NorthBridge IC
  • TG-NSP25 is available in 30cc syringes, 6 and 12oz cartridges and 5 gallon pails.

Applications

  • Electronic components: IC、CPU、MOS…
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub…
  • DDR II Module、DVD Applications、Hand-set applications…等

Thermal Impedance V.S Pressure (mouse over)

Physical Property TG-NSP25 Unit Tolerance Test Method
Thermal Conductivity
2.5
W / mK
±0.25
ASTM D5470
Color
Gray灰
-
-
Visual
Solid Content
100
%
-
-
volume Resistivity
5000
Pa·s
-
Brookfield
Density
2.6
g / cm3
-
ASTM D792
Low MW Siloxane (D4-10)
0
ppm
-
GC/MS
TML
0.2
%
-
ASTM E595
CVCM
0.1
%
-
ASTM E595
Volume Resistivity
1014
Ohm-cm
-
ASTM D257
Working Temp.
-50 to 150
°C
-
-
Standard package
78g/ 143g/ 1KG
Tube/Pot
-
-

Reliability

Thermal Impedance Initial 250 Hour 500 Hour 1000 Hour

80℃ Aging

0.124

0.125

0.127

0.126

150℃ Aging

0.128

0.129

0.129

0.130

85℃ / 85% RH

0.126

0.128

0.129

0.131


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