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Home > Products > Thermally Conductive Silicone Interface Pads > TG Series Ultra Soft Thermal Conductive Pad > TG-X Ultra Soft Thermal Pad

Ceramic Heat Spreader

pre-cut for different shape.

MSDS RELIABILITY 導熱膠帶 ROHS UL

TG-X Ultra Soft Thermal Pad

Feature

  • Very good thermal conductivity
  • Compliancy, high compressibility 70%
  • Natural tack
  • Low hardness (shore 00)
  • Low oil bleed. Long term stability
  • Electrical insulating

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Thermal Adhesive Tape Thermal Paste Manufacturer
Property TG-X Unit Tolerance Test Method
Thermal Conductivity
12
W / mK
±1.2
ASTM D5470
Thickness
0.5~2.0
mm
-
ASTM D374
0.0197~0.0787
inch
-
ASTM D374
Color
Gray
-
-
Visual
Flame Rating
V-0
-
-
UL 94
Dielectric Breakdown Voltage
12
KV / mm
±1.2
ASTM D149
Weight Loss
<1
%
-
ASTM E595
Specific Gravity
3.4
g / cm3
±0.2
ASTM D792
Working Temperature
-45~+200
°C
-
-
Volume Resistance
>1011
Ohm-cm
-
ASTM D257
Standard Shape
-
Sheet ones
-
-
Hardness
65
Shore 00
±15
ASTM D2240

Gap FillerREACH Compliant MCPCBRoHS Compliant Thermal PasteUL Compliant

     

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Pre-cut for different shapes

 


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