Ultra Soft Thermal Conductive Pad TG-6050 | T-Global Thermal Technology
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Home > Products > Thermally Conductive Silicone Interface Pads > TG Series Ultra Soft Thermal Conductive Pad > TG-6050 Ultra Soft Thermal Conductive Pad

Non-silicone Thermal Pad Thermal Compound Thermal Interface Material

pre-cut for different shape.

MSDS ROHS UL

TG-6050 Ultra Soft Thermal Conductive Pad

Feature

  • Very good thermal conductivity
  • Compliancy, high compressibility 80%
  • Natural tack
  • Low hardness (shore 00)
  • Low oil bleed. Long term stability
  • Electrical insulating

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

Thermal Impedance V.S Pressure (mouse over)

Thermal Compound Manufacturer Thermal Pad Thermal Paste Manufacturer LED Thermal Pad
Property TG6050 Unit Tolerance Test Method
Thermal Conductivity
6
W / mK
±0.6
ASTM D5470
Thickness
0.5~5.0
mm
-
ASTM D374
0.0197~0.1969
inch
-
ASTM D374
Color
Red
-
-
Visual
Flame Rating
V-0
-
-
UL 94
Dielectric Breakdown Voltage
13
KV / mm
±1.3
ASTM D149
Weight Loss
<1
%
-
ASTM E595
Specific Gravity
3.2
g / cm3
±0.2
ASTM D792
Working Temperature
-45~+200
°C
-
-
Volume Resistance
>1012
Ohm-cm
-
ASTM D257
Elongation
50
%
-
ASTM D412
Tensile Strength
0.5
Kgf / cm2
-
ASTM D412
Standard Shape
Sheet ones
-
-
-
Hardness
60
Shore 00
±15
ASTM D2240

Thermal Compound ManufacturerREACH Compliant Thermal Interface MaterialRoHS Compliant Thermal Interface MaterialUL Compliant

     

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