Thermal Composite Material X889 | T-Global Thermal Technology
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MCPCB Ceramic Heat Spreader

pre-cut for different shape.

LED Thermal Pad Gap FillerThermal Adhesive Tape Thermal Paste

X889 Thermal Composite Material

Feature

  • Good heat spreader
  • Good thermal conductivity
  • Easy to assemble
  • High stability

Application

  • Electronic components: IC、CPU、MOS
  • LED、M/B、P/S、Heat Sink、LCD-TV、Notebook PC、PC、Telecom Device、Wireless Hub……etc.
  • DDR II Module、DVD Applications、Hand-set applications……etc.

 

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Non-silicone Thermal Pad Thermal Compound Manufacturer
Property X889 X889-1 Unit Test Method
(3 Layers)
Thermal Silicone+
Graphite+
Thermal Silicone
(3 Layers)
Thermal Silicone+
AI+
Thermal Silicone

Color

Gray

Gray

-

Visual

Thickness

0.25~0.6

0.13

mm

ASTMD 374

0.098~0.0236

0.051

inch

ASTMD 374

Thermal Conductivity

X,Y, 400

Z,4

W / mK

ASTME 1530

Z,5

Flame rating

V-0

V-0

-

UL94

Dielectric Breakdown Voltage

>1

>2

KV / mm

ASTMD 149

Weight Loss

<1

<1

%

ASTM E595

Specific Gravity

1.85

1.85

g / cm³

ASTMD 792

Working Temperature

-40 ~ +200

-40 ~ +200

-

Volume Resistance

2.2x10¹²

2.2x10¹²

Ohm-cm

ASTMD 257

Thermal CompoundREACH Compliant Thermal Interface MaterialRoHS Compliant Thermal Interface MaterialUL Compliant


Ceramic Heat Spreader