Ceramic Heat Spreader XL-25 | T-Global Thermal Technology
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Thermal Pad

Available to apply adhesive,
pre-cut for different shape.

Non-silicone Thermal Pad ROHS COMPLIANCE Thermal Adhesive Tape

XL-25 Ceramic Heat Spreader

Feature

  • Big air-contact area, good heat spreader
  • Low weight
  • High Voltage Breakdown / High Resistance
  • Easy to assemble
  • The special shape can be ordered

Application

  • Power Transistor、 Power Module、CPU、Chip IC、PC Board

Thermal Impedance V.S Pressure (mouse over)

Thermal Paste Manufacturer

Property

XL-25

Unit

Tolerance

Test Method

Thermal Conductivity
6.79
W / mK
±0.67
-
Color
Gray/Green
-
-
Visual
Insulation Strength
500
Voltage
-
ASTM D149
Specific Gravity
1.89
g / cm3
±0.18
CNS 619
Surface Resistance
>109
Ohm
-
ASTM D257
Flexural Strength
47.5
Kgf / cm2
-
CNS 12701
Porosity
30
%
-
CNS 619
Working Temperature
<500
°C
-
-
Linear Thermal Expansion Coefficient
4.13
10-6
-
RT~300°C
Main Composition
Sic/Al2O3/SiO2
-
-
-
Hardness
5~6
Moh’s
±0.6
DIN En101-1992
Standard Sizes (mm)

1. 10x10x2.0 (Flat)

2. 15x15x2.0 (Flat)

3. 15x15x2.5 (Flat)

4. 20x15x2.0 (Flat)

5. 20x20x2.0 (Flat)

6. 20x20x2.5 (Flat)

7. 30x30x2.0 (Flat)

8. 30x30x2.5 (Flat)

9. 40x40x2.0 (Flat)

10. 40x40x2.5 (Flat)

11. 40x40x3.0 (Embossed)

12. 25x25x5.0 (fin)

13. 38x38x11.5 (Embossed)

14. 50x50x3.0 (fin)


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